Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Insulative housing or support
Reexamination Certificate
1997-09-18
2001-07-17
Chaudhuri, Olik (Department: 2814)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Insulative housing or support
C438S110000, C438S127000
Reexamination Certificate
active
06261872
ABSTRACT:
BACKGROUND OF THE INVENTION
1. Field of the Invention
The present invention relates to an integrated electronics package for integrating various electronic components that form an electronic circuit, such as an RF circuit, which is relatively simple to form and thus less expensive than known electronic packages and eliminates the need for glass feedthroughs for interconnections.
2. Description of the Prior Art
Various electronic packaging systems and methods for forming integrated packages for electronic circuits, such as RF circuits, are known in the art. Examples of such an electronic packaging systems and methods are disclosed in U.S. Pat. Nos. 2,903,627; 3,401,309; 5,138,436; 5,148,135; 5,365,108; 5,376,909; 5,422,615; 5,526,867 and 5,602,141. In such electronic packaging systems, the various electronic components forming the electronic circuit are interconnected and housed to form an integrated assembly. The electronic components which form the circuit may be discrete components, integrated circuits as well as microwave monolithic integrated circuits (MMIC). Electronic packaging systems for interconnecting and integrating such components are known. For example, U.S. Pat. No. 2,903,607 discloses an electronics package for integrating discrete electronic components. U.S. Pat. No. 3,401,309 discloses an electronics package for integrating various electronic components including integrated circuits while U.S. Pat. No. 5,138,426 discloses an electronics package for integrating various electronic components including MMIC's.
In many known applications of electronic packaging systems, various electronic components including IC's and MMIC's which form part of an electronic circuit of interest are known to be carried by single or multiple layer substrates or printed circuit boards. In such applications, in order to provide a connection from one layer of the substrate or printed circuit board to the other or to components on different sides of the substrate or printed circuit board, glass feedthroughs are known for interconnecting the circuitry in such configurations. The glass feedthroughs essentially include a via or hole filled with a glass insulator which surrounds an electrical conductor. Examples of such glass feedthroughs are disclosed in U.S. Pat. Nos. 4,915,719 and 5,653,834. The process for forming the glass feedthroughs can be relatively complicated, for example as set forth in U.S. Pat. No. 5,653,834. As such, electronic packages which utilize such glass feedthroughs are relatively expensive to fabricate. In addition, there are other known problems associated with such glass feedthroughs. In particular, such glass feedthroughs are known to leak or become damaged during testing and use.
Other known electronic packaging systems require multiple steps to fabricate. For example, as disclosed in U.S. Pat. No. 5,602,421 discloses an electronics package in which two ceramic layers are sandwiched between two metal layers. While such an electronic package may be suitable as an electronic package, the multiple steps and layers of the package generally increase the cost and complexity of the electronics package.
SUMMARY OF THE INVENTION
It is an object of the present invention to solve various problems in the prior art.
It is yet another object of the present invention to provide an electronics package for integrating various electronic components including IC's and MMIC's which obviates the need for glass feedthroughs.
It is yet another object of the present invention to provide an electronics package for integrating various electronic components in an electronic circuit which is relatively simple to fabricate relative to known electronics packages.
The present invention relates to an advanced electronics package for integrating electronic components of an electronic circuit, such as RF circuits. An important aspect of the invention relates to the simplicity in forming and integrating the electronic components in the package relative to known electronics packages. In one embodiment of the invention, various ceramic preforms are utilized which may be cast with temperature durable electronic components or formed as interconnect channels or feedthroughs. The preforms, in turn, are adapted to be cast into a composite housing, for example, an aluminum silicon carbide (AlSiC) housing. The component preforms may include resistors, capacitors, and inductors. In addition, RF pins as well as DC pads may be cast in the housing. The electronic components are electrically coupled to an interconnect channel or feedthrough. Interconnections by way of the interconnect channels or feedthroughs within the package may be made by way of metal infusion of a metal, such as aluminum, into the ceramic of the interconnect channels. In an alternate embodiment of the invention, a polymer based integrated package, formed from a polymer, is molded around a cast base which acts as a heat sink. Interconnection between the various electronic components is made by either molding interconnect metal tracings in the polymer housing or by way of interconnection vias which are filled with polymer based conductive paste or immersion plating. In both embodiments, interconnections between electronic components forming the electronic circuit are made without the use of glass feedthroughs which greatly simplifies the cost and complexity of the package.
REFERENCES:
patent: 2903627 (1959-12-01), McGarvey
patent: 3401309 (1968-09-01), Shatz
patent: 4487999 (1984-12-01), Baird et al.
patent: 4547836 (1985-10-01), Anthony
patent: 4647476 (1987-03-01), Anthony
patent: 4732780 (1988-03-01), Mitoff et al.
patent: 4841101 (1989-06-01), Pollock
patent: 4890663 (1990-01-01), Yarahmadi
patent: 4899118 (1990-02-01), Polinski, Sr.
patent: 4915719 (1990-04-01), Saffari et al.
patent: 5055966 (1991-10-01), Smith et al.
patent: 5114881 (1992-05-01), Kaneko et al.
patent: 5136271 (1992-08-01), Nishioka et al.
patent: 5138436 (1992-08-01), Koepf
patent: 5148135 (1992-09-01), Stein
patent: 5163499 (1992-11-01), Newkirk et al.
patent: 5170142 (1992-12-01), Bier
patent: 5175067 (1992-12-01), Taylor et al.
patent: 5185654 (1993-02-01), Mosher et al.
patent: 5214498 (1993-05-01), Lehman et al.
patent: 5259436 (1993-11-01), Yun et al.
patent: 5311920 (1994-05-01), Cook
patent: 5347258 (1994-09-01), Howard et al.
patent: 5365108 (1994-11-01), Anderson et al.
patent: 5376909 (1994-12-01), Nelson et al.
patent: 5384434 (1995-01-01), Mandai et al.
patent: 5387888 (1995-02-01), Eda et al.
patent: 5394930 (1995-03-01), Kennerknecht
patent: 5422615 (1995-06-01), Shibagaki et al.
patent: 5448826 (1995-09-01), Goetz et al.
patent: 5455118 (1995-10-01), Cook
patent: 5526867 (1996-06-01), Keck et al.
patent: 5528076 (1996-06-01), Pavio
patent: 5602421 (1997-02-01), Li
patent: 5653834 (1997-08-01), Azzaro et al.
patent: 001 890 (1978-10-01), None
patent: 157 505 (1985-03-01), None
patent: 198 698 (1986-04-01), None
patent: 444 820 (1991-02-01), None
Brunone David J.
Hathaway James A.
Reyes Michelle M.
Chambliss Alonzo
Chaudhuri Olik
TRW Inc.
Yatsko Michael S.
LandOfFree
Method of producing an advanced RF electronic package does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method of producing an advanced RF electronic package, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of producing an advanced RF electronic package will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2476692