Food or edible material: processes – compositions – and products – Direct application of electrical or wave energy to food... – Heating by electromagnetic wave
Patent
1996-02-13
1997-12-30
Yeung, George
Food or edible material: processes, compositions, and products
Direct application of electrical or wave energy to food...
Heating by electromagnetic wave
426458, 426523, 426560, A21D 1300
Patent
active
057027447
ABSTRACT:
A method of manufacturing a wafer comprises a series of steps. First, one proceeds with baking a mixture of flour and water to form sheets of bread. The sheets of bread are then thoroughly hydrated. The hydrated sheets are passed through a pair of roll cutters having complementary cutting surfaces, to cut a plurality of wafers, and a quantity of scrap. One then sorts the cut, hydrated wafers from the scrap by passing the wafers and scrap through a sorting drum to separate the wafers from the scrap. One then proceeds, arranging the wafers in a single horizontal layer on a surface that is substantially transparent to radiant heat, and exposes the single layer of wafers to radiant heat from above and below, to dry said wafers evenly and substantially without warping or bulging.
REFERENCES:
patent: 2942562 (1960-06-01), Luc
patent: 4352831 (1982-10-01), Cavanagh et al.
patent: 4621997 (1986-11-01), Cavanagh
Palmers Bruce
Thompson Linda
Harrington John M.
Yeung George
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