Method of producing a wired circuit board

Metal working – Method of mechanical manufacture – Electrical device making

Reexamination Certificate

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Details

C029S831000, C029S832000, C029S840000, C029S852000, C029S866000, C216S013000

Reexamination Certificate

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07895741

ABSTRACT:
A method of producing a wired circuit board includes preparing a metal supporting board, forming a metal foil on the metal supporting board, forming an insulating layer on the metal foil to expose an unneeded portion of the metal foil, etching the unneeded portion using the insulating layer as an etching resist, and forming a plurality of wires on the insulating layer.

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patent: 5377406 (1995-01-01), Matsumoto et al.
patent: 6527963 (2003-03-01), Yoshimura
patent: 6739048 (2004-05-01), Jones et al.
patent: 6801402 (2004-10-01), Subrahmanyam et al.
patent: 6841737 (2005-01-01), Komatsubara et al.
patent: 7182606 (2007-02-01), Ishii et al.
patent: 7319573 (2008-01-01), Nishiyama
patent: 2005/0186332 (2005-08-01), Funada et al.
patent: 2005-11387 (2005-01-01), None
patent: 2006-245220 (2006-09-01), None
patent: 2006-278734 (2006-10-01), None

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