Method of producing a wire bonding ball

Details Method of producing a wire bonding ball Method of producing a wire bonding ball

1986-12-10

1988-04-19

Shaw, Clifford C.

Electric heating

Metal heating

Wire, rod, or bar bonding

B23K 900

Patent

active

047391421

ABSTRACT:
A method of producing a wire bonding ball for ball bonding a metal wire to an electrode of a semiconductor chip involves producing a ball by melting the top end of the metal wire by a discharge which is conducted by applying a high voltage between said metal wire and a discharge electrode in an inactive gas ambient. The metal wire is at a positive voltage said the discharge electrode is at a negative voltage, respectively. Next, a latter period discharge is conducted by inverting the voltage polarities of the discharge electrode elements. The metal wire used is a material capable of being oxidated.

REFERENCES:
patent: 3598954 (1971-08-01), Iceland
patent: 4388512 (1983-06-01), Salzer et al.
J. Kurtz et al., "Copper Wire Ball Bonding", 5/1984.
"Ultrasonic Wire Welding", by K. I. Johnson et al., Solid State Technology, vol. 20, 1977, pp. 91-95.
"Aluminum Wire for Thermasonic Ball Bonding in Semiconductor Devices", by Bruce L. Gehman et al., Solid State Technology, vol. 26, 1983, pp. 151-158.

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