Semiconductor device manufacturing: process – Making passive device – Resistor
Patent
1998-08-28
2000-12-26
Chaudhari, Chandra
Semiconductor device manufacturing: process
Making passive device
Resistor
438381, 438382, H01L 2120
Patent
active
061658626
ABSTRACT:
After a CrSiN film and a TiW film are formed on a substrate through an intermediate insulating layer, a mask pattern is formed on the TiW film. Then a two-step dry etching treatment is performed to etch the TiW film and the CrSiN film into a specific shape. Specifically, first the TiW film is selectively etched under conditions including a large content of fluorine radicals. Then the CrSiN film is selectively etched under conditions including a large content of oxygen radicals. Accordingly, a thin film resistor can be formed with high accuracy with respect to the mask pattern.
REFERENCES:
patent: 4657628 (1987-04-01), Holloway et al.
patent: 5043295 (1991-08-01), Ruggerio et al.
patent: 5420063 (1995-05-01), Maghsoudnia et al.
patent: 5503878 (1996-04-01), Suzuki et al.
patent: 5989970 (1999-11-01), Ohkawa et al.
Ishikawa Eizi
Kondo Kenji
Soga Hajime
Blum David S
Chaudhari Chandra
Denso Corporation
LandOfFree
Method of producing a thin film resistor does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method of producing a thin film resistor, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of producing a thin film resistor will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-994090