Method of producing a thermogenetic semiconductor device

Details Method of producing a thermogenetic semiconductor device Method of producing a thermogenetic semiconductor device

1987-11-23

1988-11-08

Hearn, Brian E.

Fishing, trapping, and vermin destroying

29741, 29827, 29841, 26427213, 357 81, 437211, H01L 2302

Patent

active

047834285

ABSTRACT:
A method is described for coupling the leadframe of a thermogenetic semiconductor device to a heatsink. This method consists of screening a first layer of thermally conductive epoxy on the heatsink. The first layer is cured and a second layer is screened on the first layer. The leadframe is then deposited on the second layer and the second layer is cured. The device then goes to encapsulation and final processing.

REFERENCES:
patent: 4209799 (1980-06-01), Schierz et al.
patent: 4410927 (1983-10-01), Butt
patent: 4594770 (1986-06-01), Butt

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