Method of producing a sputtering target

Details Method of producing a sputtering target Method of producing a sputtering target

2007-10-30

2007-10-30

King, Roy (Department: 1742)

Powder metallurgy processes

Powder metallurgy processes with heating or sintering

Powder pretreatment

C419S030000, C419S033000, C419S034000

Reexamination Certificate

active

10672353

ABSTRACT:
A sputtering target contains a target material including as constituent elements Ag, In, Te and Sb with the respective atomic percents (atom. %) of α, β, γ and δ thereof being in the relationship of 0.5≦α<8, 5≦γ≦23, 17≦γ≦38, 32≦δ≦73, α≦γ, and α+β+γ+δ=100, and a method of producing the above sputtering target is provided.

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