Method of producing a smart card module, a smart card module pro

Details Method of producing a smart card module, a smart card module pro Method of producing a smart card module, a smart card module pro

1999-02-16

2000-08-01

Le, Thien M.

Registers

Records

235492, 361737, 257679, G06K 1900

Patent

active

06095423&

ABSTRACT:
The smart card module has a supporting plate which has a first contact plane and a semiconductor chip and electrically conductive connections between the semiconductor chip and the first contact plane. Apart from the first contact plane, the smart card module has, on the reverse side of the supporting plate, another connection plane that is also electrically connected to the semiconductor chip. The other connection plane may be used, for example, for turning on a built-in induction coil inside the chip body for contactless data transfer. The invention relates also to a combined smart card for contacting and contactless data transfer, which contains the smart card module. A manufacturing process is specified with a given sequence of process steps leading to the production of the smart card module.

REFERENCES:
patent: 4649418 (1987-03-01), Uden
patent: 5027190 (1991-06-01), Haghiri-Tehrani et al.
patent: 5424527 (1995-06-01), Takahira
patent: 5550709 (1996-08-01), Iwasaki
patent: 5585618 (1996-12-01), Droz
patent: 5612532 (1997-03-01), Iwasaki

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