Plastic and nonmetallic article shaping or treating: processes – Encapsulating normally liquid material – Liquid encapsulation utilizing an emulsion or dispersion to...
Patent
1988-09-13
1990-09-18
Lovering, Richard D.
Plastic and nonmetallic article shaping or treating: processes
Encapsulating normally liquid material
Liquid encapsulation utilizing an emulsion or dispersion to...
264 43, 42840221, 428914, 503214, 503215, B01J 1302, B01J 1318, B41M 5124
Patent
active
049576666
ABSTRACT:
An improved in-situ polymerization method is provided for easily producing a good slurry of strong, dense, water-resistant and anti-hygroscopic microcapsules made of an amino resin of either of melamine-formaldehyde series or the ureaformaldehyde series, in a high concentration of microcapsules, and a low viscosity.
REFERENCES:
patent: 4100103 (1978-07-01), Foris et al.
patent: 4105823 (1978-08-01), Hasler et al.
patent: 4218506 (1980-08-01), Oda et al.
patent: 4219604 (1980-08-01), Kakimi et al.
patent: 4251386 (1981-02-01), Saeki et al.
patent: 4413843 (1983-11-01), Iwasaki et al.
patent: 4423091 (1983-12-01), Iwasaki et al.
patent: 4574110 (1986-03-01), Asano et al.
patent: 4824823 (1989-04-01), Pietsch et al.
Asano, Patent Abstracts of Japan, #60-216,838, vol. 10, No. 85 (1985).
Asano et al., Patent Abstracts of Japan, #61-11138, vol. 10, No. 156 (1986).
Kawamura et al., Patent Abstracts of Japan, #61-178035, vol. 10, No. 390 (1986).
Awano Mamoru
Doi Yukio
Hattori Haruo
Inoshita Koichi
Kawamura Michio
Covert John M.
Lovering Richard D.
Showa High Polymer Co., Ltd.
Taio Paper Manufacturing Co., Ltd.
LandOfFree
Method of producing a slurry of microcapsules does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method of producing a slurry of microcapsules, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of producing a slurry of microcapsules will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1571249