Method of producing a silicide/Si heteroepitaxial structure, and

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148DIG147, 148DIG25, 148DIG72, 156612, 437200, 437248, H01L 21203

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active

047071974

ABSTRACT:
Described is a method for producing metal silicide/silicon heterostructures. The method comprises depositing a very thin Si "template" layer on a relatively cold (<200.degree. C.) silicide substrate, raising the substrate temperature into the approximate range 500.degree.-800.degree. C. and maintaining it there while depositing further Si onto the template. The resulting Si layer can be of high crystalline perfection. The silicide advantageously is CoSi.sub.2, Co.sub.x Ni.sub.1-x Si.sub.2, CoSi.sub.y Ge.sub.2-y, or NiSi.sub.2, with 0<x<1,1<y<2.

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