Method of producing a sensor subassembly, and sensor subassembly

Details Method of producing a sensor subassembly, and sensor subassembly Method of producing a sensor subassembly, and sensor subassembly

1999-10-25

2000-08-08

Moller, Richard A.

Measuring and testing

Instrument casing

73493, G01D 1124

Patent

active

060984597

ABSTRACT:
A sensor subassembly contains a base part that is formed of plastic and has a sensor holding region with sensor connections provided therein and a connection region with plug connections provided therein. A sensor element with electrical contacts is electrically conductively connected to the sensor connections. Fastened to the base part is a printed circuit board, via which an electrical connection between the sensor element and the plug connections is made.

REFERENCES:
patent: 4295117 (1981-10-01), Lake
patent: 4772217 (1988-09-01), Petersen
patent: 4866989 (1989-09-01), Lawless
patent: 5233873 (1993-08-01), Mozgowiec et al.
patent: 5581032 (1996-12-01), Uemura et al.
patent: 5650567 (1997-07-01), Ueda et al.
patent: 5767404 (1998-06-01), Kaiser et al.

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