Method of producing a semiconductor device using a reduced mount

Details Method of producing a semiconductor device using a reduced mount Method of producing a semiconductor device using a reduced mount

1998-12-23

2000-06-27

Chaudhuri, Olik

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Making plural separate devices

438 33, 438110, 438112, 438113, 438123, 438124, 438127, H01L 2144

Patent

active

060806028

ABSTRACT:
An object of the present invention is to provide a method of manufacturing a semiconductor device which enables a decrease in mounting area on a printed circuit board and an increase in space efficiency on the printed circuit board. The method of manufacturing a semiconductor device, comprises the steps of: (1) preparing a common substrate which has a plurality of unit portions for accommodating at least a semiconductor chip on each of the unit portions; (2) mounting at least a semiconductor chip on each of the unit portions; (3) supplying a thermosetting resin on a surface of the common substrate, the unit portions including semiconductor chips being covered with the thermosetting resin continuously, and hardening the thermosetting resin by heat treatment to form a solid resin body; (4) leveling the resin body on the common substrate for forming a level surface thereon; and (5) cutting the common substrate and resin body at each side of each unit portion for separating the unit portions into individual unit portions.

REFERENCES:
patent: 5273938 (1993-12-01), Lin et al.
patent: 5652185 (1997-07-01), Lee
patent: 5731231 (1998-03-01), Miyajima
patent: 5830800 (1998-11-01), Lin
patent: 5832600 (1998-11-01), Hashimoto
patent: 5882949 (1999-03-01), Okazaki

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