Method of producing a semiconductor device having a light transp

Details Method of producing a semiconductor device having a light transp Method of producing a semiconductor device having a light transp

1987-09-30

1989-03-14

Hearn, Brian E.

Fishing, trapping, and vermin destroying

437214, 29832, 29841, 29848, 29837, 26427211, 26427217, H01L 2156

Patent

active

048124206

ABSTRACT:
A method of producing a semiconductor device having a light transparent window, includes: a process of die bonding a chip onto a lead frame; a process of attaching a wall surrounding a picture element to either of the external contour surface of the surface of the chip or the light transparent window surrounding the picture element; a process of inserting the chip and the light transparent window into a metal mold in such a manner that an empty closed space is produced between the chip and the light transparent window via the wall; and a process of plastic molding the device except for the light transparent window by filling resin into the metal mold and making the resin hardened.

REFERENCES:
patent: 3622419 (1971-11-01), London et al.

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