Method of producing a semiconductor device by gang bonding follo

Details Method of producing a semiconductor device by gang bonding follo Method of producing a semiconductor device by gang bonding follo

1996-04-18

1997-07-01

Fourson, George

Fishing, trapping, and vermin destroying

437209, 437217, H01L 21607, H01L 2168

Patent

active

056438028

ABSTRACT:
A method of producing a semiconductor device is disclosed and includes steps of temporarily connecting inner leads or lands provided on a film carrier tape and electrode pads provided on an IC chip at the same time by low-temperature gang bonding, and then bonding them by point bonding. The method enhances the reliable production of a semiconductor device by reducing the influence of localized load and temperature ascribable to the short accuracy of the gang bonding jig as well as the influence of the deformation of a film carrier tape due to heat applied during point bonding.

REFERENCES:
patent: 3650454 (1972-03-01), Coucoulas
patent: 3697828 (1972-10-01), Oakes
patent: 4209355 (1980-06-01), Burns
patent: 4295912 (1981-10-01), Burns
patent: 4776509 (1988-10-01), Pitts et al.
patent: 5569956 (1996-10-01), Chillara et al.

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