Stock material or miscellaneous articles – Web or sheet containing structurally defined element or... – Adhesive outermost layer
Reexamination Certificate
2007-01-31
2011-10-25
Chang, Victor (Department: 1788)
Stock material or miscellaneous articles
Web or sheet containing structurally defined element or...
Adhesive outermost layer
C428S354000, C428S3550RA
Reexamination Certificate
active
08043698
ABSTRACT:
A wafer-processing tape, having a removable adhesive layer (2), and an adhesive layer (3), formed on a substrate film (1), wherein the tape is used in a process involving the steps of: grinding a back face of a wafer circuit substrate (5) having convex-type metal electrodes (4), and dicing the wafer circuit substrate into chips, in a state that the tape is adhered to the wafer circuit substrate; and picking up the chips, in which the chips are picked up in a state that the adhesive layer (3) is peeled from the substrate film (1) but is bonded to the individual chip.
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Japanese Office Action (Decision to Grant a Patent) with English translation dated Jun. 14, 2011, issued in corresponding Japanese patent application No. 2004-226707.
Ishiwata Shinichi
Kita Kenji
Morishima Yasumasa
Yamakawa Takanori
Birch & Stewart Kolasch & Birch, LLP
Chang Victor
The Furukawa Electric Co. Ltd.
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