Method of producing a semiconductor device

Details Method of producing a semiconductor device Method of producing a semiconductor device

1997-03-06

1999-11-23

Nguyen, Nam

Radiation imagery chemistry: process, composition, or product th

Including control feature responsive to a test or measurement

430 22, 356399, 356401, G03C 500, G03F 900

Patent

active

059897627

ABSTRACT:
An alignment correcting method for an aligner is disclosed. A designated number of wafers are selected out of a single lot and have their alignment marks measured in terms of coordinates. Subsequently, a preselected number of wafers are selected out of the wafers undergone measurement in the descending order with respect to closeness to a mean value or a center value of scattering, exposed, and then developed. An alignment correction value is calculated on the basis of the developed wafers.

REFERENCES:
patent: 3690881 (1972-09-01), King
patent: 3963489 (1976-06-01), Cho
patent: 5532091 (1996-07-01), Mizutani
patent: 5643699 (1997-07-01), Waldner
patent: 5656402 (1997-08-01), Kasuga
patent: 5674651 (1997-10-01), Nishi
patent: 5695897 (1997-12-01), Mitome et al.
patent: 5798195 (1998-08-01), Nishi
patent: 5856054 (1999-01-01), Tomimatu

Affiliated with

Also associated with

Rating

Method of producing a semiconductor device does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of producing a semiconductor device, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of producing a semiconductor device will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1219778