Method of producing a semiconductor component having a...

Details Method of producing a semiconductor component having a... Method of producing a semiconductor component having a...

2005-10-11

2005-10-11

Chambliss, Alonzo (Department: 2814)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Making plural separate devices

C438S126000

Reexamination Certificate

active

06953708

ABSTRACT:
A method for producing a semiconductor component with the following steps. A semiconductor chip is provided having electrical contacts in a contact making region. A housing including a rear plate and a side area is provided and surrounds the semiconductor chip. A first compliant buffer layer is applied on a rear plate. The semiconductor chip is applied to the first compliant buffer layer, and a second compliant buffer layer is applied to and around the semiconductor chip except in the contact making region. A contact passage plate is provided with an opening over the contact areas and the contact passage plate is fixed to the second compliant buffer layer.

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Austrian Patent Office Service and Information Sector, Singapore Search Report, dated May 14, 2004, 7 pages.

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