Method of producing a semiconductor arrangement

Details Method of producing a semiconductor arrangement Method of producing a semiconductor arrangement

1974-03-22

1976-02-03

Tupman, W.

Metal working

Method of mechanical manufacture

Assembling or joining

29590, 29591, B01J 1700

Patent

active

039356353

ABSTRACT:
A method of producing a semiconductor arrangement comprises electrolytically depositing a thickening onto a metal layer, at the contact points for the semiconductor arrangement, which metal layer is intended to eventually form conducting paths for the semiconductor arrangement and effectively covers the relevant semiconductor body surface.

REFERENCES:
patent: 3495324 (1970-02-01), Guthrie
patent: 3556951 (1971-01-01), Cerniglia

Affiliated with

Also associated with

Rating

Method of producing a semiconductor arrangement does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of producing a semiconductor arrangement, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of producing a semiconductor arrangement will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2116173