Metal working – Method of mechanical manufacture – Electrical device making
Reexamination Certificate
2005-08-09
2005-08-09
Chang, Richard (Department: 3729)
Metal working
Method of mechanical manufacture
Electrical device making
C029S401100, C029S402060, C324S758010
Reexamination Certificate
active
06925699
ABSTRACT:
A method of producing a quantity of integrated circuits, that includes testing a set of semiconductor wafers that is made up of a first subset and a second subset. This first subset is configured in such a manner that a first tester is more readily adapted to perform the testing but the second subset is configured in such a manner that a second tester is more readily adapted to perform the testing. A first tooling plate and a second tooling plate are provided. The first tooling plate is attached to a probe station. Then the probe station is mated to the first tester to test the first subset of wafers. In turn, the second tooling plate is attached to the probe station. The probe station is then mated to the second tester to test the second subset of wafers. Finally, the first wafer and said second wafer are diced into the quantity of individual integrated circuits.
REFERENCES:
patent: 4527942 (1985-07-01), Smith
patent: 4588346 (1986-05-01), Smith
patent: 5149029 (1992-09-01), Smith
patent: 5264787 (1993-11-01), Woith et al.
patent: 5440943 (1995-08-01), Holt et al.
patent: 5450766 (1995-09-01), Holt
patent: 5528158 (1996-06-01), Sinsheimer et al.
patent: 5552701 (1996-09-01), Veteran et al.
patent: 5608334 (1997-03-01), Holt
patent: 5656942 (1997-08-01), Watts et al.
patent: 6060892 (2000-05-01), Yamagata
patent: 6114869 (2000-09-01), Williams et al.
patent: 6166553 (2000-12-01), Sinsheimer
patent: 6271658 (2001-08-01), Vallinan et al.
patent: 6304092 (2001-10-01), Jordan
patent: 0699 913 (1996-03-01), None
patent: WO 96/30772 (1996-10-01), None
Chang Richard
Klarquist & Sparkman, LLP
LandOfFree
Method of producing a quantity of integrated circuits does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method of producing a quantity of integrated circuits, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of producing a quantity of integrated circuits will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3450127