Method of producing a quantity of integrated circuits

Metal working – Method of mechanical manufacture – Electrical device making

Reexamination Certificate

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Details

C029S401100, C029S402060, C324S758010

Reexamination Certificate

active

06925699

ABSTRACT:
A method of producing a quantity of integrated circuits, that includes testing a set of semiconductor wafers that is made up of a first subset and a second subset. This first subset is configured in such a manner that a first tester is more readily adapted to perform the testing but the second subset is configured in such a manner that a second tester is more readily adapted to perform the testing. A first tooling plate and a second tooling plate are provided. The first tooling plate is attached to a probe station. Then the probe station is mated to the first tester to test the first subset of wafers. In turn, the second tooling plate is attached to the probe station. The probe station is then mated to the second tester to test the second subset of wafers. Finally, the first wafer and said second wafer are diced into the quantity of individual integrated circuits.

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