Method of producing a printed board assembly and a shielding...

Metal working – Method of mechanical manufacture – Electrical device making

Reexamination Certificate

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Details

C029S832000

Reexamination Certificate

active

06263564

ABSTRACT:

This application claims priority under 35 U.S.C. §§ 119 and/or 365 to 9704894-6 filed in Sweden on Dec. 29, 1997; the entire content of which is hereby incorporated by reference.
The invention relates, generally, to shielding of components on printed board assemblies and, more specifically, to a method of producing a printed board assembly having shielding means as well as to a shielding element cooperating with shielding means on a printed board assembly for electrically shielding components on the printed board assembly.
BACKGROUND
From GB-2 261 324-A, it is known to shield a printed board assembly by applying a shielding material to a conductor on a printed board and, then, depending on the shielding material, harden it, e.g. by means of UV light. The shielding material on the printed board is intended to cooperate with a shielding housing that may be provided with grooves or other recesses to improve the seal and the contact with the shielding material on the printed board.
Applying shielding material to a printed board assembly already produced, requires an additional production step as does hardening of the shielding material in a separate production step.
Thus, a printed board assembly in accordance with said GB-2 261 324-A will be quite expensive to produce.
SUMMARY
The object of the invention is to bring about a method of producing printed board assemblies having shielding means, which is cheaper and simpler than the methods known so far.
This is attained by the method according to the invention in that, before the components are soldered to conductors on the printed board in a furnace soldering step, a string of a heat curing, electrically conductive material is deposited around the site where at least one component to be electrically shielded, is to be furnace soldered to the printed board, and that said string is cured in the same step as the components are furnace soldered to the conductors on the printed board to form a shielding gasket.
Hereby, great savings in production costs will be made in that the curing and the soldering are carried out in the same process step instead of in two separate process steps.


REFERENCES:
patent: 4125307 (1978-11-01), Thayer
patent: 4157007 (1979-06-01), Vennard
patent: 4714905 (1987-12-01), Berstein et al.
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patent: 5084961 (1992-02-01), Yoshikawa
patent: 5332829 (1994-07-01), Hagiwara
patent: 5477419 (1995-12-01), Goodman et al.
patent: 5545281 (1996-08-01), Matsui et al.
patent: 5761053 (1998-06-01), King et al.
patent: 5763824 (1998-06-01), King et al.
patent: 5975408 (1999-11-01), Goossen
patent: 6090728 (2000-07-01), Yenni, Jr. et al.
patent: 0 654 962 (1995-05-01), None
patent: 2 261 324 (1993-05-01), None

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