Method of producing a polyimide multilayer wiring board

Details Method of producing a polyimide multilayer wiring board Method of producing a polyimide multilayer wiring board

1993-07-28

1995-06-27

Johnstone, Adrienne

Metal working

Method of mechanical manufacture

Electrical device making

29843, 156182, 156230, 156247, 156249, H01R 909, H05K 336

Patent

active

054268494

ABSTRACT:
A polyimide multilayer wiring board is constructed by using a plurality of laminated blocks each of which has a plurality of wiring layers and interlaminar insulating layers of polyimide. On a base block having a substrate, the other blocks are laid on top of another, bonded to each other with a polyimide used in each block or another adhesive and electrically connected to each other by using, for example, metal bumps formed on each block. Each of the blocks except the base block is formed on a temporary substrate, and the temporary substrate is removed after bonding each block to the base block or precedingly bonded blocks. This multilayer wiring board can be produced in a shortened time with increased yield.

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Japanese Patent Abstract (JP-a-02 012 990), vol. 14, No. 154, (E-907), Jan. 17, 1990 Appln. No. 63-163771 filed Jun. 30, 1988 entitled "Multilayer Printed Circuit Board".

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