Method of producing a multi-layered wiring board

Details Method of producing a multi-layered wiring board Method of producing a multi-layered wiring board

2006-09-05

2006-09-05

Arbes, Carl J. (Department: 3729)

Metal working

Method of mechanical manufacture

Electrical device making

C029S825000, C029S852000, C174S261000, C438S637000, C438S652000

Reexamination Certificate

active

07100275

ABSTRACT:
Method of producing a multi-layered wiring board comprising the steps of subjecting the photosensitive resin to exposure- and development-treatment to form the holes having a predetermined size and shape; depositing and forming the curable resin to the insulating layer having the holes formed therein in such a manner as to bury the holes, and conducting heat-treatment to form the cured thin film of the curable resin on the surface of the insulating layer; and so removing the curable resin as to leave the cured thin film to obtain the via-holes having the reduced opening size by the cured thin film.

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patent: 11-121645 (1999-04-01), None

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