Method of producing a multi-layered ceramic circuit board

Details Method of producing a multi-layered ceramic circuit board Method of producing a multi-layered ceramic circuit board

1995-05-30

1997-10-14

Simmons, David A.

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

156246, 156252, 156277, 264 61, B32B 3126

Patent

active

056767811

ABSTRACT:
A method of producing multi-layered ceramic circuit boards comprising laminated, component ceramic layers containing at least one hollow inorganic powder and at least one non-hollow inorganic powder. Signal transmitting conductor patterns of the boards are free from an irregular cross-sectional profile which is caused by particles of the hollow inorganic powder contained in the component ceramic layers. These multi-layered ceramic circuit boards are particularly useful for high speed transmission of digital signals of particularly high frequency.

REFERENCES:
patent: 4867935 (1989-09-01), Morrison, Jr.
patent: 5275889 (1994-01-01), Yokouchi et al.
patent: 5324370 (1994-06-01), Aoki et al.
patent: 5458709 (1995-10-01), Kamezaki et al.

Affiliated with

Also associated with

Rating

Method of producing a multi-layered ceramic circuit board does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of producing a multi-layered ceramic circuit board, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of producing a multi-layered ceramic circuit board will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1552245