Metal fusion bonding – Process – Diffusion type
Patent
1989-03-03
1990-10-16
Heinrich, Sam
Metal fusion bonding
Process
Diffusion type
228170, 400124, B23K 3100, B23K10136, B23K 2000
Patent
active
049628763
ABSTRACT:
In a method of producing a movable part of a wire-dot print head comprising an armature supported by a plate spring, and a lever having a tip to which print wire is fixed, the armature and the lever are formed of alloys containing identical atoms or alloys easy to diffuse into each other, a bond part of a base part of the lever is inserted in a bond groove in a tip of the armature, and the lever and the armature are heat-treated in vacuum at a temperature not lower than 1100.degree. C. and below the melting points of the lever and the armature, so that the lever and the armature are diffusion-bonded.
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patent: 4610553 (1986-09-01), Yasunaga et al.
patent: 4618277 (1986-10-01), Asano et al.
patent: 4652158 (1987-03-01), Asano et al.
patent: 4798488 (1989-01-01), Uozumi
patent: 4883219 (1989-11-01), Anderson et al.
patent: 4886382 (1989-12-01), Oota et al.
Andou Hirokazu
Kikuchi Hiroshi
Shimomura Tatsuhiko
Heinrich Sam
OKI Electric Industry Co., Ltd.
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