Method of producing a metallization layer structure

Details Method of producing a metallization layer structure Method of producing a metallization layer structure

1990-09-27

1992-03-17

Beck, Shrive

Coating processes

Applying superposed diverse coating or coating a coated base

Metal coating

156656, 2041921, 4272554, 4272557, 4273761, 4273833, 4274197, 428420, 428698, 428699, B05D 136

Patent

active

050967495

ABSTRACT:
A metallization layer structure containing, in order, an aluminum nitride ceramic base layer, an aluminum titanium nitride layer, a titanium layer, a heat-resistant metallic layer and a metallic layer for facilitating soldering and brazing. The aluminum titanium nitride layer is formed at the interface between the aluminum nitride ceramic base layer and the titanium layer by subjecting a laminate containing, in order, an aluminum nitride ceramic base layer, a titanium layer, a heat-resistant metallic layer and a metallic layer for facilitating soldering and brazing to a heat treatment within the range of 350.degree.-1000.degree. C. for 40 minutes.

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Chemical Abstracts, vol. 107, No. 20, Abstract No. 182020q, Nov. 1987, p. 382.

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