Method of producing a jumper chip for semiconductor devices

Details Method of producing a jumper chip for semiconductor devices Method of producing a jumper chip for semiconductor devices

1988-01-26

1989-06-13

Goldberg, Howard N.

Metal working

Method of mechanical manufacture

Electrical device making

29827, 228193, 228194, 22826312, H05K 334

Patent

active

048379280

ABSTRACT:
In the manufacture of semiconductor device packages, a jumper chip, comprising a substrate and a gold alloy attached thereto, with improved bonding characteristics is provided. By applying a coating of gold on both sides of the gold alloy prior to attaching the gold alloy to the substrate, the bonding of the gold alloy to the substrate and to the gold coating of the cavity in a device package is improved. Scrubbing of the jumper chip on the gold coating of the cavity is obviated. The additional gold layers applied to the gold alloy are distinct and visible on a photograph of a cross-section of the jumper chip.

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