Method of producing a high-density printed wiring board for moun

Details Method of producing a high-density printed wiring board for moun Method of producing a high-density printed wiring board for moun

1995-10-05

1998-04-14

Arbes, Carl J.

Metal working

Method of mechanical manufacture

Electrical device making

29845, 174 522, 174267, H05K 336

Patent

active

057378339

ABSTRACT:
A method of producing a high-density wiring board for mounting comprises the steps of providing an electroconductive metallic film on the main surface thereof with a photosensitive resist layer, subjecting the photosensitive resist layer to selective exposure to light and development thereby forming holes for selectively exposing the surface of the electroconductive metallic foil in the photosensitive resist layer, depositing an electroconductive metal by plating on the exposed surface of the electroconductive metallic foil thereby forming electroconductive bumps thereon, peeling off the remainder of the photosensitive resist layer, superposing an insulating polymer sheet on the electroconductive bump forming surface, pressing the resultant superposed layers so that the electroconductive bumps to pierce the polymer sheet in the direction of thickness thereof and allowing the leading end parts of the electroconductive bumps to emerge from the polymer sheet and give rise to connecting terminal parts, and selectively etching off the electroconductive metallic foil thereby forming a wiring pattern.

REFERENCES:
patent: 4788767 (1988-12-01), Desai et al.
patent: 4813128 (1989-03-01), Massopust
patent: 4991285 (1991-02-01), Shaheen et al.
patent: 5259110 (1993-11-01), Bross et al.
patent: 5432999 (1995-07-01), Capps et al.
patent: 5457881 (1995-10-01), Schmidt

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