Method of producing a frame made of connected semiconductor die

Details Method of producing a frame made of connected semiconductor die Method of producing a frame made of connected semiconductor die

1996-03-27

1997-03-25

Picardat, Kevin M.

Fishing, trapping, and vermin destroying

437211, 437214, 437217, 437220, H01L 2160

Patent

active

056144431

ABSTRACT:
Method of producing a frame made of connected semiconductor die mounting substrates comprises i) a first step for producing a metal substrate sheet wherein an original material for metal substrate sheet of a desired size is cut out from a metal material and an erosion preventing layer is provided on the entire surface thereof, ii) a second step for producing a circuit substrate sheet wherein the circuit substrate sheet is made of a resin substrate coated with a copper leaf layer and is provided with a lead pattern on the surface thereof in place, iii) a third step for producing a connected semiconductor die mounting substrate sheet by adhering the metal substrate sheet to the circuit substrate sheet, iv) a fourth step for forming a plurality of pilot apertures and slits on the connected semiconductor die mounting substrate sheet by press working and v) a fifth step for producing a plurality of connected semiconductor die mounting substrate frames by separating the connected semiconductor die mounting substrate sheet.

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patent: 5397921 (1995-03-01), Karnezos
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patent: 5492866 (1996-02-01), Nishikawa

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