Method of producing a flip chip

Details Method of producing a flip chip Method of producing a flip chip

1995-12-28

1997-09-16

Picardat, Kevin

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Assembly of plural semiconductive substrates each possessing...

438119, 438613, H01L 2160

Patent

active

056680589

ABSTRACT:
A flux is applied to a circuit board on which solder is deposited beforehand. Then, the circuit board is subjected to reflow and then to rinsing. After the rinsing, an IC chip 1 having metal bumps on its electrodes, is mounted to the circuit board. Before the mounting, the chip 1 and circuit board are heated in an inactive gas atmosphere having a low oxygen concentration. At the time of mounting, the solder is melted at a temperature higher than its melting point so as to connect the chip 1 to the circuit board.

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