Method of producing a field effect transistor

Fishing – trapping – and vermin destroying

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437227, 437902, 437912, 437974, 148DIG28, H01L 218252

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active

054340942

ABSTRACT:
FET devices according to the invention are made by etching separation grooves and the via-holes from the front surface of the substrate. Thereafter, the thickness of the substrate is reduced from the rear surface to expose the plating in the via-holes and separation grooves. A rear surface electrode and a plated heat sink are sequentially deposited on the rear surface of the thinned substrate. The devices are divided from a wafer by etching and/or severing along the separation grooves and at opposed locations along the plated heat sink.

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Saito et al, "X and Ku Band High Efficiency Power GaAs FETs", IEEE MTT-S Digest, pp. 265-267, 1983.
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