Method of producing a COF flexible printed wiring board

Details Method of producing a COF flexible printed wiring board Method of producing a COF flexible printed wiring board

2007-04-03

2007-04-03

Coleman, W. David (Department: 2823)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Incorporating resilient component

C257SE21516, C257SE21591

Reexamination Certificate

active

11078293

ABSTRACT:
The present invention provides a COF flexible printed wiring board whose insulating layer is not melt-adhered to a heating tool, to thereby enhance reliability and productivity of a semiconductor chip mounting line, and also provides a method of producing the COF flexible printed wiring board. The COF flexible printed wiring board contains an insulating layer, a wiring pattern, on which a semiconductor chip being mounted, formed of a conductor layer provided on at least one side of the insulating layer and a releasing layer, wherein the releasing layer is formed from a releasing agent containing at least one species selected from a silane compound and silica sol and is provided on a surface of the insulating layer, which is opposite to the mounting side of the semiconductor chip.

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