Method of producing a chip-type solid electrolytic capacitor

Details Method of producing a chip-type solid electrolytic capacitor Method of producing a chip-type solid electrolytic capacitor

2006-09-19

2008-01-22

Smith, Matthew (Department: 2823)

Semiconductor device manufacturing: process

Making passive device

Stacked capacitor

C438S381000, C438S397000, C438S398000, C257SE21008, C257SE21011, C257SE21017

Reexamination Certificate

active

07320924

ABSTRACT:
A chip-type solid electrolytic capacitor comprises capacitor elements. A cathode terminal comprising a plate-like conductor is interposed between cathode layers of the capacitor elements. The capacitor elements are bonded to each other by a bonding agent such as a solder or a conductive adhesive. The cathode terminal is provided with a through hole formed at a portion to be brought into contact with each of the capacitor elements. Bonding surfaces of the capacitor elements are directly connected at the through hole.

REFERENCES:
patent: 5198967 (1993-03-01), Kuranuki et al.
patent: 6343004 (2002-01-01), Kuranuki et al.
patent: 6343044 (2002-01-01), Hsu et al.
patent: 2001-284192 (2001-10-01), None
patent: 2004-363526 (2004-12-01), None
patent: 10-0191759 (1999-06-01), None

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