Method of producing a ceramic package main body

Details Method of producing a ceramic package main body Method of producing a ceramic package main body

1996-12-31

1998-10-20

Arbes, Carl J.

Metal working

Method of mechanical manufacture

Electrical device making

29840, 257686, 257700, 174 524, H05K 302

Patent

active

058228519

ABSTRACT:
In a ceramic package main body having a circuit wiring provided to a ceramic substrate and including first and second independent circuit wires, first and second conductive layers are formed on the ceramic substrate. A first connection wire is provided to connect between the first circuit wire and the first conductive layer. A second connection wire is provided to connect between the second circuit wire and the second conductive layer. The first and second conductive layers are electrically insulated from each other for enabling to examine an electrical connection between the first and second conductive layers and determine, from the result of the examination, whether a short circuit is developed between the first and second circuit wires.

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