Method of producing a ceramic electronic device

Details Method of producing a ceramic electronic device Method of producing a ceramic electronic device

1993-11-24

1997-02-04

Simmons, David A.

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

156253, 264 31, 264 61, B32B 3118, B32B 3126

Patent

active

055994130

ABSTRACT:
For minimizing the size of a ceramic electronic device for elimination of noise in a digital circuit installed in an electric apparatus, a method comprises the steps of placing a ceramic layers structure encapsulating internal electrodes on a substrate which has a plurality of apertures arranged therein, making through holes in the ceramic layers structure by applying a sand blasting through the apertures of the substrate, and forming in the through holes external electrodes connected to the internal electrodes.

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Richerson, D. W., "Final Machining" in Modern Ceramic Engineering, 1992, pp. 596-602.
Search report dated Nov. 2, 1994.

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