Method of producing a beveled peripheral profile on a semiconduc

Details Method of producing a beveled peripheral profile on a semiconduc Method of producing a beveled peripheral profile on a semiconduc

1987-10-05

1988-12-27

Schmidt, Frederick R.

Abrasive tool making process, material, or composition

Impregnating or coating an abrasive tool

51289R, B24B 100, B24B 906

Patent

active

047931027

ABSTRACT:
In a method of producing a beveled peripheral profile on a semiconductor disk (1), the peripheral profile is ground by an obliquely-arranged grinding disk (7). The centering of the semiconductor disk (1) in the clamping device, consisting of clamping heads (3, 6), preferably occurs via a bonded-on molybdenum disk (2), which runs on a guide disk (9). The employment of a diamond grinding disk with suitable grains and binder is particularly appropriate.

REFERENCES:
patent: 2782565 (1957-02-01), Jones
patent: 3262234 (1966-07-01), Roach
patent: 4031667 (1977-06-01), Sehestedt
patent: 4227347 (1980-10-01), Tam
patent: 4580368 (1986-04-01), Smith

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