Method of processing semiconductor wafer

Details Method of processing semiconductor wafer Method of processing semiconductor wafer

2006-11-28

2006-11-28

Gandhi, Jayprakash N. (Department: 2125)

Data processing: generic control systems or specific application

Specific application, apparatus or process

Product assembly or manufacturing

C700S104000

Reexamination Certificate

active

07142940

ABSTRACT:
A method of processing a semiconductor wafer is provided. The semiconductor wafer is processed with a first process. After collecting the measured data that reflects the deviation of each part within the semiconductor wafer, the semiconductor wafer is processed with a second process according to the measured data to compensate the deviation from the first process and to correct any deviation in the semiconductor wafer.

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