Method of processing high-resolution flex circuits with low...

Details Method of processing high-resolution flex circuits with low... Method of processing high-resolution flex circuits with low...

2006-02-07

2006-02-07

Lam, Cathy F. (Department: 1775)

Stock material or miscellaneous articles

Display in frame or transparent casing; or diorama including...

Peripheral enclosure or frame

C428S209000, C428S901000

Reexamination Certificate

active

06994897

ABSTRACT:
A mechanism and a method for framing a low-distortion flexible dielectric substrate during subsequent flex circuit processing. The processing method comprising the following steps: making a flexible dielectric substrate having an outer periphery; joining a continuous portion of the flexible dielectric substrate near the outer periphery to a rigid open frame, the flexible dielectric substrate being in a state other than a state of substantially uniform tension as a result of the joinder; causing the joined flexible dielectric substrate to undergo a change to the state of substantially uniform tension; and printing an electrical conductor on the flexible dielectric substrate while the flexible dielectric substrate is joined to the frame and in the state of substantially uniform tension. The frame is in the shape of a polygon (e.g., a rectangle) with rounded vertices.

REFERENCES:
patent: 3879509 (1975-04-01), Elderbaum
patent: 3955021 (1976-05-01), Cleavenger
patent: 4802945 (1989-02-01), Opina
patent: 5474458 (1995-12-01), Vafi et al.
patent: 5627903 (1997-05-01), Porrazzo et al.
patent: 5748006 (1998-05-01), Sano
patent: 6323096 (2001-11-01), Saia et al.

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