Method of processing a workpiece

Etching a substrate: processes – Etching and coating occur in the same processing chamber

Reexamination Certificate

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Reexamination Certificate

active

11088261

ABSTRACT:
This invention relates to a method of processing a workpiece in a chamber. Initially a surface of the workpiece is treated by a process which includes supplying a reactive gas to the chamber through a first gas supply and the surface is then further treated using a process gas supplied to the chamber through a second gas supply during the supply of the process gas so that a portion of the process gas flows into the first gas supply from the chamber to mitigate against residual reactive gas entering the chamber during the further treatment step.

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