Method of processing a substrate including measuring for planari

Details Method of processing a substrate including measuring for planari Method of processing a substrate including measuring for planari

1998-05-19

2000-08-29

Nguyen, Vinh P.

Electricity: measuring and testing

Fault detecting in electric circuits and of electric components

Of individual circuit component or element

324758, G01R 1502

Patent

active

061114197

ABSTRACT:
A substrate (17) is probed after the planarity between a chuck (16) (or the substrate (17)) and a surface of the probing system (20), such as the bottom surface of the interface (28) or test head (22), has been checked. In one method, a measuring tool (30) having a sensor (36) is placed on a chuck (16) of the probing system (20). A distance between a sensor (36) and a surface within the probing system (20) is measured using the sensor (36). The surface is relatively flat. The sensor (36) remains spaced apart from the surface during the measuring. The measuring tool (30) is removed from the chuck (16). The substrate (17) is placed over the chuck (16) after removing the measuring tool (30) and is probed using the probing system (20). Alternatively, more than one sensor (36) can be used. Further, the sensor(s) (66, 76) could be integrated into the chuck (16), interface (28), or test head (22), thereby not requiring a separate measuring tool (30). Additionally, the method can be automated.

REFERENCES:
patent: 4751457 (1988-06-01), Veenendaal
patent: 4820975 (1989-04-01), Diggle
patent: 4934064 (1990-06-01), Yamaguchi et al.
patent: 4985676 (1991-01-01), Karasawa
patent: 5519944 (1996-05-01), Delastre
patent: 5539676 (1996-07-01), Yamaguchi

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