Method of processing a substrate in a photolithography system ut

Radiation imagery chemistry: process – composition – or product th – Post imaging processing

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414225, 414749, 414751, 901 16, 901 39, 430330, G03F 740

Patent

active

059357681

ABSTRACT:
An apparatus and a method for baking and cooling silicon substrates are disclosed. Both baking and cooling of silicon substrates are done in a single integrated thermal process module. Each thermal process module includes two hot plate assemblies, a cool plate assembly, two local linear transfer arms and a micro-processor based module controller. Both transfer arms are capable of transferring substrates among the cool and hot plate assemblies. The module controller ensures that there are no conflicts in use of the transfer arms or in use of the hot and cool plate assemblies and so that a transfer arm is always available when a substrate is finished baking. A central substrate handling robot transports substrates only from and to the cool plate assembly of the thermal process module. Also, the vacuum tubing is routed via a unique pulley arrangement to achieve compact mounting and eliminate loose tubing.

REFERENCES:
patent: 4842683 (1989-06-01), Cheng et al.
patent: 4985722 (1991-01-01), Ushijima et al.
patent: 5061144 (1991-10-01), Akimoto et al.

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