Method of processing a substrate and apparatus processing...

Details Method of processing a substrate and apparatus processing... Method of processing a substrate and apparatus processing...

2011-07-12

2011-07-12

Jolley, Kirsten C (Department: 1715)

Coating processes

Centrifugal force utilized

C427S336000, C427S352000, C134S026000, C134S033000, C118S052000, C438S758000

Reexamination Certificate

active

07976896

ABSTRACT:
A spin chuck rotatably holds a semiconductor wafer, while resist is dropped on a surface of the semiconductor wafer through a resist application nozzle and thus applied thereon, and before the resist applied on the wafer dries, a cleaning liquid is supplied through a bevel cleaning nozzle to a portion of the wafer located at a peripheral portion thereof in a vicinity of a beveled portion to remove the resist adhering to the beveled portion. Thereafter, a film of the resist that is formed on the surface of the wafer is dried.

REFERENCES:
patent: 5939139 (1999-08-01), Fujimoto
patent: 2005/0115671 (2005-06-01), Araki
patent: 2006/0272676 (2006-12-01), Iwase et al.
patent: 6-326067 (1994-11-01), None
patent: 8-51064 (1996-02-01), None
patent: 08-264412 (1996-10-01), None
patent: 9-106980 (1997-04-01), None
patent: 10-209143 (1998-08-01), None
patent: 2948501 (1999-07-01), None
patent: 2003-045788 (2003-02-01), None
patent: 2005-191511 (2005-07-01), None
English translation of JP 2948501, published Oct. 11, 1996.
English translation of JP 2003-045788 A, published Feb. 14, 2003.
Japanese Office Action issued Jan. 18, 2011, in Patent Application No. 2006-192587 with English Translation.

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