Method of processing a semiconductor wafer

Optical waveguides – With optical coupler – Particular coupling function

Reexamination Certificate

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C385S129000

Reexamination Certificate

active

06944370

ABSTRACT:
A method of processing a semiconductor wafer that has circuits in each of a plurality of regions sectioned by a plurality of streets on the front surface and has a coating layer formed on the front surface having the circuits to a predetermined thickness, the method comprising a stress-reducing step of reducing the stress of the coating layer by forming a plurality of grooves in the coating layer formed on the front surface of the semiconductor wafer; and a grinding step of processing the back surface of the semiconductor wafer by grinding to a predetermined thickness after the stress-reducing step.

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