Method of processing a semiconductor wafer

Details Method of processing a semiconductor wafer Method of processing a semiconductor wafer

2005-03-22

2005-03-22

Weiss, Howard (Department: 2814)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Making plural separate devices

C438S464000

Reexamination Certificate

active

06869830

ABSTRACT:
Prior to a grinding step, the front surface of a semiconductor wafer is stuck on a substrate to be mounted on the substrate. The transfer step of mounting the semiconductor wafer on a frame having a mounting opening in its center portion through a mounting tape and removing the substrate from the front surface of the semiconductor wafer is carried out between the grinding step and the subsequent treating step. The substrate is formed of a laminate consisting of a plurality of layers.

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