Abrading – Abrading process – With critical nonabrading work treating
Reexamination Certificate
2006-03-21
2006-03-21
Ackun, Jr., Jacob K. (Department: 3723)
Abrading
Abrading process
With critical nonabrading work treating
C134S001300, C438S692000, C216S089000
Reexamination Certificate
active
07014537
ABSTRACT:
A post-CMP cleaning process includes brush cleaning a CMPed surface, followed by at least partially drying the CMPed surface, followed by spray cleaning the CMPed surface. A method of cleaning residue from registration alignment markings formed on a semiconductor substrate includes polishing a material within which the registration alignment markings are received with a polishing solution comprising a liquid and a solid, followed by brush cleaning a remaining outermost polished surface, followed by at least partially drying the polished surface, followed by spray cleaning the outermost polished surface. Other aspects and implementations are contemplated.
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Ackun Jr. Jacob K.
Micro)n Technology, Inc.
Wells St. John P.S.
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