Method of processing a semiconductor chip package

Details Method of processing a semiconductor chip package Method of processing a semiconductor chip package

1995-03-16

1997-11-25

Oritz, Angela

Plastic and nonmetallic article shaping or treating: processes

With severing, removing material from preform mechanically,...

Flash or sprue removal type

264138, 26427217, 264334, B29C 3344, B29C 4540

Patent

active

056908776

ABSTRACT:
A method of removing dam bars (15) from leads (17) of a semiconductor chip package (10) is performed by first breaking a bond between the dam bars (15) and excess mold compound (12) from a mold compound (11). The bond is broken by slight movement of the dam bar (15). Thereafter, the dam bar (15) is completely removed by moving the dam bar (15) further, without causing chips or cracks in the mold compound (11).

REFERENCES:
patent: 3539675 (1970-11-01), Hugill
patent: 4109373 (1978-08-01), Fennessy et al.
patent: 4451973 (1984-06-01), Tateno et al.
patent: 4501540 (1985-02-01), Kako et al.
patent: 4504427 (1985-03-01), Moyer
patent: 4592131 (1986-06-01), Deie
patent: 4615857 (1986-10-01), Baird
patent: 4778146 (1988-10-01), Olla et al.
patent: 4862586 (1989-09-01), Osada
patent: 4874722 (1989-10-01), Bednary et al.
patent: 4915607 (1990-04-01), Medders et al.
patent: 4916518 (1990-04-01), Yoshimura
patent: 4946518 (1990-08-01), Spanjer et al.

Affiliated with

Also associated with

Rating

Method of processing a semiconductor chip package does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of processing a semiconductor chip package, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of processing a semiconductor chip package will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2104146