Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Patent
1996-02-14
1997-07-15
Aftergut, Jeff H.
Adhesive bonding and miscellaneous chemical manufacture
Methods
Surface bonding and/or assembly therefor
156153, 156155, 156281, 148DIG12, 148DIG135, 437225, 437974, H01L 2130, H01L 21304, H01L 21306
Patent
active
056479328
ABSTRACT:
The following steps are performed when processing electronic components such as piezoelectric devices. At Step 1 inter-atom bond is created between a functional member such as a quartz crystal plate and a first substrate, and the functional member and the quartz crystal plate are directly joined together. At Step 2, the functional member and a second substrate are fixed together with an adhesive agent or by a direct bond. At Step 3, the first substrate is removed chemically or mechanically, with said functional member and said second substrate still being joined together. A step of polishing said functional member for the adjustment of thickness thereof may be done between Step 1 and Step 2. For example, a silicon dioxide thin film may be provided between the functional member and the first substrate. Since no adhesive layer exists between the functional member and the first substrate, this improves the degree of plane of the functional member when joined to the first substrate. Therefore, functional member thickness accuracy becomes extremely high and mass productivity is also improved.
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Eda Kazuo
Kanaboshi Akihiro
Ogura Tetsuyoshi
Taguchi Yutaka
Tomita Yoshihiro
Aftergut Jeff H.
Matsushita Electric - Industrial Co., Ltd.
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