Method of printing with a differential thickness stencil

Details Method of printing with a differential thickness stencil Method of printing with a differential thickness stencil

1997-10-16

1998-09-29

Funk, Stephen R.

Printing

Stenciling

Processes

101127, B41M 112

Patent

active

058133313

ABSTRACT:
A differential thickness stencil (14') integrally formed from two sieves (601 and 602) having different thicknesses (701 and 702) for a two-stage solder printing process for printing the solder mask for a fine-pitch component alongside that of a larger component. The differential thickness stencil (14') includes a first sieve (602) having at least one through-hole (142) of a first height (702) from a top surface portion (722) of the stencil to the bottom surface (714) of the stencil. This first sieve (702) has at least one inverted well (742) having an opening on the bottom surface (744) and having a second height (746) lower than the first height (702) starting from the bottom surface (714) to an underside ceiling (746) of the top surface of the stencil. A second sieve (601) is integrally joined (603) to the first sieve (602) but this second sieve (601) has at least a second through-hole (142') of a third height (701) from a second top surface portion (711) of the stencil to the bottom surface (714)of the stencil. This third height (701)is lower than the second height of the inverted well (742) of the first sieve (602). Furthermore, this second through-hole (142') corresponds to the location of the inverted well (742).

REFERENCES:
patent: 4135020 (1979-01-01), Maxwell
patent: 4270465 (1981-06-01), Lim
patent: 4872261 (1989-10-01), Sanyal et al.
patent: 4930413 (1990-06-01), Jaffa
patent: 5368883 (1994-11-01), Beaver
patent: 5593080 (1997-01-01), Teshima et al.
RCA Technical Notes, "A Metal Mask and Screen Assembly," Balents, TN No. 978, Sep. 17, 1974, pp. 1-2. Class 101 Sub 127.

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