Method of printing electronic circuits

Metal working – Method of mechanical manufacture – Electrical device making

Reexamination Certificate

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Details

C029S831000, C029S846000, C029S847000, C029S852000

Reexamination Certificate

active

08074350

ABSTRACT:
A method of printing electronic circuits uses pattern recognition to detect locations of interconnects on electronic components oriented on a substrate such that the interconnects face away from the substrate, the interconnects having ramps between the interconnects and the substrate, adjusts routing paths as needed based upon a difference between an intended placement and an actual placement of the electronic components, and generates a new image file for printing with adjusted routing paths. A device has at least one electronic component having interconnects, a ramp from a surface of the substrate to the interconnects, wherein the ramp is formed of one of either a polymer or an adhesive, a printed, conductive path on the ramp providing electrical connection to at least one of the interconnects.

REFERENCES:
patent: 5510139 (1996-04-01), Deissner et al.
patent: 6071371 (2000-06-01), Leonard et al.
patent: 6555414 (2003-04-01), Vanfleteren et al.
patent: 6706234 (2004-03-01), Huang
patent: 2004/0151978 (2004-08-01), Huang

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