Method of printing a spot pattern in a printed circuit board

Details Method of printing a spot pattern in a printed circuit board Method of printing a spot pattern in a printed circuit board

1980-04-11

1982-04-06

Smith, John D.

Coating processes

Electrical product produced

Integrated circuit, printed circuit, or circuit board

427282, 118504, 29852, H05K 340

Patent

active

043235930

ABSTRACT:
A method of applying a paste through a hole in a printed circuit board. A mask is provided with a hole with an upper larger cross-section portion and a lower smaller cross-section portion, the junction between the portions forming a ring-shaped land. The lower hole portion has a cross-section larger than the cross-section of the hole in the printed circuit board. The printed circuit board is positioned adjacent the mask with the hole therein aligned with the hole in the mask, and paste is applied to the hole in the mask from the upper hole portion. This paste is pressed through the hole in the mask and fills the hole in the circuit board with paste and coats the surface of the circuit board which is toward the mask and/or the surface which is away from the mask in the area around and close to the hole with the paste.

REFERENCES:
patent: 3948706 (1976-04-01), Schmeckenbecher
patent: 4024629 (1977-05-01), Lemoine et al.
Brady et al., "Screening Mask for Depositing Large Area Paste Deposits," (IBM Tech. Disclosure Bulletin) vol. 20, No. 9. Feb. 1978 pp. 3429-3430.
Sponder, "Making Printed Circuits," (IBM Tech. Disclosure Bulletin) vol. 9, No. 8, Jan. 1967 pp. 965-966.

Affiliated with

Also associated with

Rating

Method of printing a spot pattern in a printed circuit board does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of printing a spot pattern in a printed circuit board, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of printing a spot pattern in a printed circuit board will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-592698