Method of preventing transfer of adhesive substance to dicing ri

Details Method of preventing transfer of adhesive substance to dicing ri Method of preventing transfer of adhesive substance to dicing ri

1995-11-28

1998-01-06

Simmons, David A.

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

156344, 437226, B32B 3300, H01L 21304

Patent

active

057050163

ABSTRACT:
The present invention disposes an easily releasing layer on a surface intended for dicing tape sticking of a dicing ring frame to thereby enable preventing the transfer of an adhesive substance to the ring frame for use in semiconductor wafer working, reducing the frequency of cleaning of the ring frame to the requisite minimum and prolonging the life of the ring frame.

REFERENCES:
patent: 4138304 (1979-02-01), Gantley
patent: 4890763 (1990-01-01), Curiel
patent: 5110388 (1992-05-01), Komiyama et al.
patent: 5118567 (1992-06-01), Komiyama et al.
patent: 5356949 (1994-10-01), Komiyama et al.
Abstract Publication No. 60-035531 for Japanese Application No. 58-144666, filed Aug. 6, 1983, 1 p.
Abstract Publication No. 61-028572 for Japananese Application No. 59-148566, filed Jul. 19, 1984, 1 p.
Yamane Kenji, Patent Abstracts of Japan, Dicing Tape of Ultraviolet Light Irradiation Type, Nov. 30, 1989, one page.
Matsushima Hiroshi; others, Patent Abstracts of Japan, Manufacture of Semiconductor Device, Sep. 3, 1992, one page.
Kuroda Hideo; others, Patent Abstracts of Japan, Method of Dicing Semiconductor Wafer, Feb. 24, 1988, one page.
Hitachi Seisakusho et al., Patent Abstracts of Japan, Supporter for Wafer, Aug. 10, 1984, one page.

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